Back end of the line or back end of line (BEOL) is a process in semiconductor device fabrication that consists of depositing metal interconnect layers onto a wafer already patterned with devices.

The back end of line (BEOL) is the final state semiconductor processing that concerns the interconnects that reside in the top part of a chip. In today's advanced IC's, that consists of up …

Jun 1, 2024 · BEOL encompasses the crucial steps in semiconductor fabrication after the Front End of Line (FEOL) processes, focusing on interconnects, packaging, and device integration.

The BEOL process is essential for establishing the electrical properties needed for semiconductor devices. It involves depositing protective layers, such as a layer of silicon dioxide, which …

Jul 2, 2024 · They divide the semiconductor manufacturing process into three stages: the front end of the line (FEOL), the middle end of the line (MEOL), and the back end of the line (BEOL).

Sep 18, 2025 · The backend-of-the-line (BEOL) is second major stage of the semiconductor manufacturing process where the interconnects are formed within a device. Interconnects, the …

Sep 4, 2023 · BEOL, or Back-End-of-Line, refers to processes that follow the formation of source/drain regions in semiconductor fabrication. BEOL is responsible for interconnecting …

While FEOL defines and makes the transistors – which are the switching elements used for computing – the BEOL represents the interconnecting layers which connect the transistors on …

In BEOL processes, materials such as Au, Ag, Al, Cu, Cr, Mo, Ni, Ta, Pt, or salicides are commonly used to establish connections or create various functions. The BATCHSPRAY ® …

Back end of line (BEOL) refers to the set of processes involved in connecting isolated MOS transistors into a complete circuit or module, including the interconnects and I/O pads.