HBM has become one of the most successful and widely adopted examples of chiplet-based integration in AI systems.
Thermal management in energy conversion hardware is an increasingly critical field in response to the worldwide drive for electrification and deployment of ...
Abstract: Thermal resistance of the Thermal Interface Materials (TIMs) between power module and heatsink plays a significant role in thermal stress. This paper investigates the variances in thermal ...
Abstract: Aiming at the insufficiency of the connection and separation technology between the space sub-star and the mother star, this paper puts forward a kind of electro-propulsion module mooring ...
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