Semiconductor Engineering

Low-Cost TSV Repair Architecture Specialized for Highly Clustered TSV Faults Within HBM

A new technical paper titled “Low Cost TSV Repair Architecture Using Switch-Based Matrix for Highly Clustered Faults” was published by researchers at Yonsei University. “Through-silicon via (TSV), ...
Nasdaq

ASE Announces FOCoS-Bridge With TSV; Latest Package Technology Reduces Power Loss by 3x for Next-Generation AI and HPC Applications

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today ...
Digi Times

Samsung, SK Hynix keen to develop new TSV, focus ring, debonding solutions for next-gen HBM

As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology used in this field.
Semiconductor Engineering

HBM4 Sticks With Microbumps, Postponing Hybrid Bonding

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...
Digi Times

ASE bets on new chip tech to handle AI’s rising power and speed needs

ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial intelligence (AI) and high ...