Amidst arrivals of proprietary, internal through-silicon-via (TSV) interconnect solutions by STMicroelectronics and Aptina Imaging (a Micron Technology arm dedicated to imaging and wafer-level cameras ...

ASE Announces FOCoS-Bridge With TSV; Latest Package Technology Reduces Power Loss by 3x for Next-Generation AI and HPC Applications Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV ...

From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias ...

SEOUL, Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered ...

As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology used in this field.

Dublin, Jan. 09, 2018 (GLOBE NEWSWIRE) -- The "High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends" report has been added to Research and Markets' offering. The ...

The AI boom has fueled the high-performance semiconductor market. SK Hynix, in light of investment reduction, has elected to expand its HBM technology capabilities through recent allocations of ...

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today ...