A circuit board packaging technique in which the leads (pins) on the chips and components are soldered on top of the board. Boards can be made faster because surface mount technology (SMT) eliminates ...

Nexperia’s GaN FET devices, featuring next-gen high-voltage GaN HEMT technology in proprietary copper-clip CCPAK surface mount packaging, are now available to designers of industrial and renewable ...

Alpha and Omega has turned to 5 x 6mm LFPAK surface-mount packaging for a family of mosfets aimed at industrial, server power, solar, and telecommunication applications. Available at 40V, 60V, and ...

Raleigh, N.C. — Stackpole Electronics Inc. has developed a new SMD resistor technology to address increased demand for higher limiting element voltage handling in surface-mount packaging. Designated ...

What are the 2 categories of mounting method in IC packaging? Describe these categories and its package types. The final step in IC fabrication is packaging the device in a suitable medium that can ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Toshiba has introduced four dual-channel 150Mbit/s digital isolators in 4.9 x 6 x 1.75mm surface-mount packaging. Options allow two channels in one direction, or one channel in each direction, and ...