As chip manufacturing scales up, water supply and wastewater treatment systems are under immense pressure. Cutting-edge ...

FuGasity Corp. today said it has received a notice of allowance for a patent from the U.S. Patent and Trademark Office. The patent would cover the Allen, Texas-based company’s technology for ...

The SOC designer's world is made up of two distinct groups-the logic, or system-level, designers and the physical-layout designers. Logic designers work on functional and timing issues, and physical ...

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Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

The semiconductor manufacturing process involves many steps, including, but not limited to, film deposition, photolithography, etching, and chemical mechanical polishing (CMP). Contamination can ...

DOWNERS GROVE, Ill., Oct. 29, 2025 /PRNewswire/ -- Malema™, part of PSG and Dover (NYSE: DOV) and a leading provider of flow meter technologies for use in industrial and semiconductor applications, ...