Debuting at CES 2025, AEGIS leverages advanced AI and modular sensor technology to deliver unmatched insights for monitoring diverse environments, enhancing safety, awareness, and adaptability in real ...
A soft material performs NAND logic with visible light, showing a path toward materials that process information without conventional electronic circuitry. “This project has been part of my scientific ...
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SK hynix announces 321-layer, UFS 4.1 chips — TLC 4D NAND set to land in PCs and data centers
Leading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND flash. The super dense NAND chips which will power these UFS 4.1 ICs are ...
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