Thanks to an innovative extension to 3D printing, researchers can create high-performance, low-weight “unbuildable” RF structures that combine dielectrics and patterned conductors. The benefits and ...
Multi-material AM (MM-AM) combines the efficiency and flexibility of 3D printing with diverse material properties and complex geometries for enhanced functionalities. This technology allows for the ...
Top Magnetics Corp.’s TMCI3225 and TMCI4532 multilayer chips offer inductance ranges from 0.1 µH to 33 µH. Based on a proprietary multilayer printing manufacturing process, they achieve a 40% in ...
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