Vinci today announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under ...

Please provide your email address to receive an email when new articles are posted on . Inspired by the lack of consistency in mechanical ventilation training, doctors at Cleveland Clinic developed a ...

PITTSBURGH, Nov. 16, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems ...

Hardware-in-the-loop (HiL) refers to testing a component while embedding it in one or more of its likely environments. These environments are represented virtually by computer models. The tested ...

“Addressing complex engineering challenges such as developing products that are more powerful, yet greener, lighter yet stronger requires a fully-integrated CAE solution,” said Jean-Claude Ercolanelli ...

MUNICH--(BUSINESS WIRE)--SimScale GmbH announced new features for engineers focused on structural and mechanical simulation, including large scale vibration analysis and modal-based harmonics.

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

In a deal that underscores the ever-growing ties between Silicon Valley and Detroit, software tools provider Applied Intuition has acquired vehicle dynamics specialist Mechanical Simulation Corp. The ...

Vinci announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs.

Vinci’s physics AI foundation model delivers deterministic, solver-accurate warpage analysis across extreme scales—already in production use at leading hardware companies Vinci today announced the ...