Intel's lifetime deal value for its IFS foundry business is now over $10 billion, indicating strong growth potential in advanced packaging. TSMC will supply Intel with 5,000 Foveros wafers per month, ...

The chiplet-based approach allows Intel to mix-and-match these tiles to offer three distinct iterations of Panther Lake: the ...

Intel has confirmed that it’s working on a discrete graphics solution for “client PCs,” which will arrive in 2020. That, however, is far from all Intel is working on. The company laid out its ...

Intel has revealed more details on its upcoming 3D Foveros packaging technology, which it will be using to built its next-gen Meteor Lake, Arrow Lake, and Lunar Lake CPUs of the future. The company ...

Intel Foveros isn’t the name of a new chip, but rather a technology that will allow the chipmaker to bundle various vertical chip components, and thus improve the speed of devices without having to ...

This article is part of the Technology Insight series, made possible with funding from Intel. We tend to focus on the latest and greatest technology nodes because they’re used to manufacture the ...

Like most people in tech, we have oh-so-many questions about Intel's discrete GPU efforts, and if things stay on track, we will get some official answers sometime this year. Until then, we're left to ...

Intel has kicked off the hype train for its next-gen Lakefield processor, which will be the first to use Intel's new Foveros 3D packaging technology, and will start production later in the year. The ...

Intel is leading in the semiconductor industry with its Advanced Packaging technology and Gaudi2 chips. Advanced Packaging drives Intel's global domination in the chip race, enhancing performance and ...

Intel is providing a sneak peek (in rendered form) of its upcoming Lakefield processor family, which is based off its new Foveros three-dimensional stacked packaging technology that it detailed during ...

Intel is unveiling packaging innovations for creating three-dimensional chip packages and other solutions that put together multiple chips. In advance of the Semicon West conference in San Francisco, ...