May 2014 – Si2 announces new thermal interface protocol standard for 3D Integrated Circuits. The Chip Thermal Interface Protocol (CTIP) facilitates the exchange of thermal design information required ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...

In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits ...

The next generation of Thermal Interface Materials (TIMs) offer the opportunity to gain a quantum leap in thermal efficiency, reliability, and market growth. IDTechEx research finds the market size of ...

The benefits of thermal interface materials. Comparing FR-4 laminate with insulated metal substrate (IMS) PCB. How phase-change TIMs may prove to be the best solution. One of the most important—and ...

The significant decreases in the size of power integrated circuits (ICs) have enabled system designers to achieve reductions in power-supply solution size and cost, which is critical to furthering the ...

The AI revolution is driving change in how we design and manufacture everything from data centers to servers and chips. Even what we consider a chip is changing from the integration of analog circuits ...

The relentless pursuit of performance in sectors such as AI, cloud computing, and autonomous driving is creating a heat crisis. As the next generation of processors demand more power in smaller spaces ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Phison Electronics Corp. (TPEX: 8299), a global leader in NAND flash controller integrated circuits and storage solutions, today entered into the high-speed ...

Market forecasts for thermal interface materials 2015-2025 - Source: IDTechEx Research report "Thermal Interface Materials 2015-2025: Status, Opportunities, Market Forecasts" According to a report ...