Semiconductor Engineering

Package Assembly Design Kits: The Future Of Advanced Package Design

Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...
Semiconductor Engineering

Package Assembly Design Kits (PADK) Benefits For Packaging Design Engineers

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.
Arizona Daily Star

Amkor and Cadence to Develop Packaging Assembly Design Kits for Amkor’s SLIM and SWIFT Packaging Technologies

products and its services is available at http://www.cadence.com. Note: The Amkor name and logo are registered trademarks, and SLIM and SWIFT are trademarks of Amkor ...
EDN

5 keys to next-generation IC packaging design

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.
Morningstar

ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of IDE 2.0, a major upgrade to its Integrated Design ...
EDN

Intel ups the advanced packaging ante with EMIB-T

Embedded Multi-die Interconnect Bridge-T (EMIB-T) was a prominent highlight of the Intel Foundry Direct Connect event. Intel is promoting this advanced packaging technology as a key building block for ...