PITTSBURGH, Nov. 16, 2023 /PRNewswire/ -- Ansys (NASDAQ: ANSS) has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3D-IC systems ...

Ansys Inc. (Pittsburgh, Pa., U.S.) has announced that simulation product Ansys 2025 R2 features new AI-powered capabilities across the portfolio that accelerate simulation and expand accessibility. R2 ...

PITTSBURGH — August 24, 2022 – Ansys (NASDAQ: ANSS) said today that Ansys Mechanical is one of the first commercial finite element analysis (FEA) programs supporting AMD Instinct accelerators, the ...

PITTSBURGH, Jan. 28, 2020 /PRNewswire/ -- Companies are accelerating digital transformation by integrating cutting-edge ANSYS (NASDAQ: ANSS) technology across product lifecycle processes through new ...

ANSYS, Inc. ANSS recently strengthened its collaboration with NVIDIA and Supermicro to offer Turnkey hardware solutions that dramatically enhance Ansys Multiphysics simulation capabilities. This ...

The collaboration is expected to reduce a significant amount of time and money while designing the product. New Delhi: Autodesk and ANSYS have joined hands to provide the customers with improved ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

A Canonsburg-based simulation software firm that employs thousands of local residents will be acquired by another publicly traded company in a huge deal worth $35 billion. Ansys, which has operated in ...

Ansys ANSS announced that its DME and multiphysics simulation solutions will be used by Astrobotic's Peregrine lunar lander to make the first CLPS (Commercial Lunar Payload Services) missions to the ...

Ansys Inc has announced a first milestone in coupling Ansys and Ansoft products, successfully performing multiphysics simulations that involve electromagnetic applications. The simulations target ...

Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...

The joint solution provides a high-speed and high-capacity cloud solution for analyzing the mechanical stresses in 2.5D/3D-IC multi-die systems, which extends product reliability Ansys Mechanical is ...