Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...

The company held its Samsung Foundry Forum 2024 in San Jose, California, and teased its new 3D packaging technology for HBM chips in a public event, with current-gen HBM memory chips packaged mostly ...

AMD has teased the launched of a new Ryzen processor with two chiplets, each of which will include a healthy dollop of 3D V-Cache.

Researchers have invented a new way to align 3D semiconductor chips by shining a laser through concentric metalenses patterned on the chips to produce a hologram. Their work can help to lower the cost ...

Agentic AI is driving a major transformation in computing, enabled by more powerful processors and new semiconductor manufacturing techniques. Traditional single-chip architectures are reticle-limited ...

Researchers used 3D printing and capillary action to create customizable neural chips, expanding design freedom for brain research, biosensors and biocomputing. (Nanowerk News) Cultured neural tissues ...