When its FDM process alone was inefficient for creating prototypes, Oertli 3D printed positive molds to serve as a thermoforming template for the Mayku Multiplier. In the realm of advanced medical ...

Dutch chip gear maker ASML has lifted the kimono its Twinscan XT:260, a new lithography scanner built for the brave new world of 3D chip packaging. The outfit claims that it is the first machine of ...

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures Addresses Manufacturing Pain ...

The company held its Samsung Foundry Forum 2024 in San Jose, California, and teased its new 3D packaging technology for HBM chips in a public event, with current-gen HBM memory chips packaged mostly ...

Lam Research LRCX is putting more focus on advanced packaging as demand for AI chips grows. In the fourth quarter of fiscal 2025, management noted that demand for AI chips is pushing the industry ...

The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the ...

Navid Asadi is an assistant professor in the department of electrical and computer engineering at university of Florida. His research is mainly focused on physical inspection of electronics from ...

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...

The PackML automation standard is used in the packaging machine industry to transfer and receive consistent data between machines on a packaging line. While it's well known to machine builders, it ...